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中文摘要: 太空任务的快速发展,使航天领域对在轨实时智能处理能力产生迫切需求。构建高智能化算力体系是满足该需求的有效途径,而星载人工智能芯片则是实现这一目标的关键。面对日益复杂的太空环境与算力需求,基于传统闭源指令集架构研发的星载人工智能芯片存在授权风险与能效受限等问题,早期硬件架构在执行复杂人工智能推理任务时算力不足。因此,探索新的架构范式与应用模式成为星载人工智能芯片行业共识。梳理星载人工智能芯片国内外应用现状,系统论述星载人工智能芯片产业发展现状与趋势,在此基础上,总结星载人工智能芯片在指令集架构开源、异构硬件架构、多星多智能等方面的发展趋势,为相关技术研发与产业布局提供参考。
Abstract:The rapid advancement of space missions has created an urgent demand for real-time intelligent processing capabilities in orbit within the aerospace sector. Establishing a highly intelligent computing architecture represents an effective solution to meet these in-orbit real-time processing requirements, with spaceborne AI chips serving as the key enabler. Faced with increasingly complex space environments and computational demands, spaceborne AI chips developed based on traditional closed-source instruction set architectures face challenges such as licensing risks and energy efficiency limitations. Early hardware architectures also exhibit insufficient computational power when handling complex AI inference tasks. Consequently, exploring new architectural paradigms and application models has become an industry consensus for spaceborne AI chips. This paper reviews the current application status of spaceborne AI chips globally, systematically analyzes the development status and trends of the industry, and summarizes key trends in areas such as open-source instruction set architectures, heterogeneous hardware architectures, and multi-satellite multi-intelligence systems. These insights aim to provide a reference for relevant technological R&D and industrial planning.
keywords: Spaceborne artificial intelligence chip Hyper-heterogeneous Distributed Open-source instruction set architecture Swarm intelligence
文章编号:20260303 中图分类号:TP302.1; TN4; V443; V19 文献标志码:A
基金项目:“十四五”民用航天技术预先研究项目(D040201)
| 作者 | 单位 |
| 刘鹏英 | 航天恒星科技有限公司 北京交通大学 |
| 何颖 | 中国航天科技国际交流中心 |
| 田路云 | 航天恒星科技有限公司; 空间信息体系与融合应用全国重点实验室 |
| 贺广均 | 航天恒星科技有限公司; 空间信息体系与融合应用全国重点实验室 |
引用文本:
刘鹏英,何颖,田路云,贺广均.星载人工智能芯片应用现状与产业发展研究[J].飞控与探测,2026,9(3):20-28.
刘鹏英,何颖,田路云,贺广均.星载人工智能芯片应用现状与产业发展研究[J].飞控与探测,2026,9(3):20-28.

