Abstract:In order to improve the quality factor of the Hemispherical Shell Resontor(HSR), a wet etching method is proposed in this paper to remove the micro-defects on the subsurface of the HSR. By investigating the wet etching mechanism of the fused silica material, an accuracy of sub-micron etching level can be achieved by utilizing specialized wet etching equipment. The experimental results show that the surface roughness of HSR after wet etching is reduced to less than 100nm, the quality factor of HSR can be increased to more than 20 million, and the frequency split is guaranteed to be less than 0.03Hz.