Abstract:On-chip integrated optical phased arrays (OPA), which utilize semiconductor processes to integrate multiple optical components onto a single chip, demonstrate remarkable advantages in size, cost, and stability, thereby enabling next-generation all-solid-state light detection and ranging (LiDAR) systems. This paper first introduces the fundamental principles of OPA, followed by a detailed exposition of mathematical models of the field of view (FOV) and sidelobe suppression ratio (SLSR). Subsequently, we review recent advances in OPA chips regarding wide FOV and high SLSR. Finally, we summarize current technical challenges in on-chip OPA and provide perspectives on future development trajectories.