Abstract:The phenomenon of high overload impact often occurs in applications such as aerospace, military weapons and equipment. The modern missile-borne circuit system can measure the environmental acceleration, velocity and stress load in real time to achieve accurate control and intelligence of weapon devices. Therefore, the protection and buffer technology which is based on polymer material pouring inside the heterogeneous composite structure, is extremely important to ensure the normal operation of the circuit and avoid the failure of signal output abnormality. In this paper, ANSYS LS-DYNA finite element display dynamics simulation software is used to numerically simulate the heterogeneous composite circuit structure filled with polymer materials. In addition, stress response and transfer behavior triggered by the contact surface between the circuit shell and the support body are researched, and similar stress transfer laws and stress distribution laws such as polymer materials and circuit board structures are analyzed. The research results can also provide a necessary theoretical basis for the structural design and layout of electronic components.