本文已被:浏览 503次 下载 119次
中文摘要: 针对工程使用过程中,振动、冲击和过载等力学输入造成微机电(Micro-Electro Mechanical System, MEMS) 陀螺及组合性能恶化的问题,对国外MEMS陀螺及组合力学环境适应性技术研究进展进行了梳理。从敏感结构、封装体、器件/系统层级,设计、加工工艺、封装和系统集成等角度,介绍国外主流的力学环境适应性技术方法,为国内相关技术的研究提供参考。
Abstract:In view of the performance deterioration of MEMS gyroscopes and modules caused by mechanical inputs such as vibration, shock and overload during operation, the research progress of the mechanical environment adaptability technology for MEMS gyroscopes and modules abroad is presented. From the levels of sensors, packages, and devices/systems, as well as design, fabrication, packaging and integration, the mainstream technologies and methods of mechanical environment adaptability abroad are introduced, which provide a reference for research of domestic related technologies.
文章编号:20190602 中图分类号: 文献标志码:
基金项目:
引用文本:
刘 飞,王汝弢,郭中洋,张菁华.国外MEMS陀螺及组合力学环境适应性技术研究进展[J].飞控与探测,2019,(6):12-17.
刘 飞,王汝弢,郭中洋,张菁华.国外MEMS陀螺及组合力学环境适应性技术研究进展[J].飞控与探测,2019,(6):12-17.